TOKYO--(Antara/BUSINESS WIRE)-- Toshiba Electronic Devices & Storage Corporation ("Toshiba") announces a new range of video interface bridge devices intended for modern automotive In-Vehicle Infotainment (IVI) applications.
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Increasingly, Systems-on-Chip (SoCs) from smartphones and tablets have been used in automotive applications as IVI systems became more sophisticated, requiring more functionality and greater performance. However, due to differing connectivity standards on devices such as displays, existing SoCs often lack of necessary interfaces required for automotive networks.
Toshiba's new range of video interface bridge devices provide HDMI to MIPI® CSI-2 (TC9590), MIPI® CSI-2 to/from parallel (TC9591) and MIPI® DSI to LVDS (TC9592/3) connectivity. The devices are offered in 0.65mm pitch, VFBGA packages between 5 x 5 mm and 7 x 7mm, with the exception of the TC9590 which is housed in an LFBGA64, 0.8mm pitch 7 x 7mm package.
The TC9592, with its single link, 5 pairs/link LVDS output is suitable for connecting SoCs to a UXGA 1600 x 1200 24-bit display. The TC9593 provides a dual link, 5 pairs/link LVDS output, making it ideal for displays up to WUXGA 1920 x 1200 in size.
The TC9591 can be configured to convert 24-bit parallel data at 154 MHz to 4-lane MIPI® CSI-2, or MIPI® CSI-2 to 24-bit parallel data at 100 MHz. The TC9590 supports HDMI 1.4a at its input and 4-lane MIPI® CSI-2 at its output.
All of the devices operate from -40°C to +85°C, although the TC9591XBG extends the upper limit to +105°C.
Toshiba has a long history in developing MIPI®-based interface bridge chips for consumer applications and have drawn on their experience in this area while developing the new automotive IVI range.
Sample shipments of the new devices start this month.
TC9591XBG TC9590XBG TC9592XBG TC9593XBG
Input - MIPI® CSI2
RX 4Lanes x
1ch
- Parallel input
24bit@154MHz HDMI 1.4a MIPI® DSI
4 Lanes x 1ch MIPI® DSI
4 Lanes x 1ch
Output - Parallel output
24bit@100MHz
- MIPI® CSI2-TX
4Lanes x 1ch MIPI®
CSI2-TX 4
Data Lanes x
1ch LVDS
Single Link
(5 pairs/ link ) LVDS
Dual Link
(5 pairs/ link )
Resolution --- --- UXGA
1600x1200
@24bit WUXGA
1920x1200
@24bit
Ta -40 to 105 °C -40 to 85 °C -40 to 85 °C -40 to 85 °C
PKG VFBGA80
7mm x 7mm
0.65mm pitch LFBGA64
7mm x 7mm
0.8mm pitch VFBGA49
5mm x 5mm
0.65mm pitch VFBGA64
6mm x 6mm
0.65mm pitch
Notes:
HDMI and the HDMI logo are trademarks or registered trademarks of HDMI licensing in U.S. and other countries.
MIPI® mark and logo is registered trademark of MIPI® Alliance, Inc.
For further information about the new products, please visit:
https://toshiba.semicon-storage.com/ap-en/product/automotive/interface-bridge.html
Customer Inquiries
Mixed Signal IC Sales and Marketing Department
Tel: +81-44-548-2826
https://toshiba.semicon-storage.com/ap-en/contact.html
Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.
About Toshiba Electronic Devices & Storage Corporation
Toshiba Electronic Devices & Storage Corporation combines the vigor of a new company with the wisdom of experience. Since becoming an independent company in July 2017, we have taken our place among the leading general devices companies, and offer our customers and business partners outstanding solutions in discrete semiconductors, system LSIs and HDD.
Our 19,000 employees around the world share a determination to maximize the value of our products, and emphasize close collaboration with customers to promote co-creation of value and new markets. We look forward to building on annual sales now surpassing 700-billion yen (US$6 billion) and to contributing to a better future for people everywhere.
Find out more about us at https://toshiba.semicon-storage.com/ap-en/company.html
View source version on businesswire.com: https://www.businesswire.com/news/home/20180604005576/en/
Contacts
Media Inquiries:
Toshiba Electronic Devices & Storage Corporation
Chiaki Nagasawa, +81-3-3457-4963
Digital Marketing Department
semicon-NR-mailbox@ml.toshiba.co.jp
Source: Toshiba Electronic Devices & Storage Corporation
Reporter: PR Wire
Editor: PR Wire
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