TOKYO--(Antara/BUSINESS WIRE)-- Toshiba Memory Corporation, the world leader in memory solutions, today announced that it has begun shipping samples of embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS[1] version 2.1[2]. The new products meet AEC-Q100 Grade2[3] requirements and support a wide temperature range of -40°C to +105°C, offering the enhanced reliability capabilities that are required by increasingly complex automotive applications. The line-up meets a broad range of applications requirements with five different capacities: 16GB, 32GB, 64GB, 128GB and 256GB. [4]
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The new products are embedded NAND flash memory products that integrate NAND chips fabricated with 15nm process technology and a controller in a single package. Storage requirements for automotive applications continue to increase as systems including automotive information & entertainment systems and ADAS[5] become more sophisticated, and UFS supports their high performance and density needs. The addition of automotive UFS expands Toshiba Memory Corporation's line-up of embedded NAND flash memory products for automotive applications, which currently includes automotive e-MMC[6] products. Utilizing the UFS interface allows the new products to achieve sequential read of 850MB/s and random read of 50kIOPs, which are approximately 2.7 times and 7.1 times faster than their current e-MMC counterparts, respectively.[7]
Other new functions specifically suited to automotive applications have been added to the new UFS products, including Refresh, Thermal Control and Extended Diagnosis. Refresh can be used to refresh data stored in the UFS and can contribute to the extension of the data's life span. Thermal Control protects against overheating in the high temperatures that can occur in automotive applications. Extended Diagnosis helps users to understand the condition of the product.
Toshiba Memory Corporation's UFS products have been used to boost overall system performance in mobile devices, and the introduction of automotive UFS products is expected to have a similarly positive impact on the development of automotive information & entertainment systems and ADAS. Toshiba Memory Corporation is already in discussion with major automobile makers on the possibility of implementing the new line-up in next-generation projects. As the storage requirements for automotive applications continue to grow, Toshiba Memory Corporation will continue to lead the market by reinforcing its lineup of high-performance, high-density memory solutions targeting the sector.
Outline of the New Products
Interface JEDEC UFS V2.1 standard
HS-G3 interface
Capacity 16GB, 32GB, 64GB, 128GB, 256GB
Power Supply Voltage 2.7-3.6V (Memory core)
1.7V-1.95V (Interface)
Temperature Range -40oC to +105oC
Product Name Capacity Package Sample Date
THGAF9G7L1LBAB7 16GB 153Ball FBGA 11.5x13.0x1.0mm Dec. 2017
THGAF9G8L2LBAB7 32GB 153Ball FBGA 11.5x13.0x1.0mm Dec. 2017
THGAF9G9L4LBAB8 64GB 153Ball FBGA 11.5x13.0x1.2mm Dec. 2017
THGAF9T0L8LBAB8 128GB 153Ball FBGA 11.5x13.0x1.2mm Dec. 2017
THGAF9T1LBLBABY 256GB 169Ball FBGA 12.0x16.0x1.6mm 2Q, 2018 (Apr. - Jun.)
Key Features
1. Extended Temperature Range
Supports operating temperature range of -40°C to +105°C.
Reliability tests were conducted to meet AEC-Q100 Grade2 specifications, in addition to JEDEC compliance tests.
2. Wide Capacity Range
Supports a wide range of capacities, from 16GB to 256GB, to suit a variety of automotive applications, including automotive information & entertainment systems and ADAS, which typically needs high capacity storage, plus other applications, such as wireless communication, which may need only a small capacity.
3. High Performance
By utilizing the UFS interface, the new products achieve a sequential read of 850MB/s and random read of 50kIOPs, which are approximately 2.7 times and 7.1 times faster than their current e-MMC counterparts, respectively. [7]
4. Additional Functions Suited for Automotive Applications
Supports additional functions suited for automotive applications includes Refresh, Thermal Control and Extended Diagnosis.
*Company names, product names, and service names mentioned herein may be trademarks of their respective companies.
Notes
[1] Universal Flash Storage (UFS) is the product category for the class of embedded memory products built to the JEDEC UFS standard specification.
[2] One of standard specifications of embedded NAND flash memory defined by JEDEC.
[3] Electrical component qualification requirements defined by the AEC (Automotive Electronics Council).
[4] Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary with the host device and application. 1GB is calculated as 1,073,741,824 bytes. For details, please refer to applicable product specifications.
[5] Advanced Driving Assistant System
[6] e-MMC is a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification.
[7] Comparison of Toshiba Memory Corporation's 64GB devices.
Customer Inquiries:
Memory Marketing Division
Tel: +81-3-3457-3451
http://toshiba.semicon-storage.com/ap-en/contact.html
Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.
View source version on businesswire.com: http://www.businesswire.com/news/home/20171211006358/en/
Contacts
Media Inquiries:
Toshiba Memory Corporation
Koji Takahata, +81-3-3457-3822
Sales Strategic Planning Division
semicon-NR-mailbox@ml.toshiba.co.jp
Source: Toshiba Memory Corporation
Reporter: Adityawarman
Editor: PR Wire
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